GDK Multi-D Automatic Silicone Glue Dispensing System
Full Auto High Speed Glue Dispensing Machine
| Model |
Multi-D |
| Parameter |
|
| Transport height |
900±20mm |
| Transport speed |
2-5m/min |
| Transport direction |
L→R(R→L Optional) |
| Dispense Valve |
Non contact piezoelectric injection valve |
| Valve pressure stabilizing device |
Electronic communication synchronous pressure stabilizing device |
| Valve vacuum cleaning device |
Standard vacuum cleaning device |
| Valve nozzle heating device |
Nozzle heating device |
| Options |
|
| High speed dispensing valve |
Ceramic valve,screw valve, two-component valve, etc. |
| Transmission mode |
One-stage transportation(two-stage transportation, three-stage transportation) |
| Altimetry system |
Non contact laser altimetry |
| Weighing system |
Accuracy of microbalance: 0.01mg, 0.1mg |
| Product Heating |
Product preheating, heating structure at the bottom of the work area |
| Machine parameters |
|
| Overall dimension |
W1180*H1480*L1415(Excluding tricolor lights, monitor and keyboard) |
| PCB size |
500*500 |
| Weight |
850kg |
| Pressure |
0.6Mpa |
| Air consumption |
40 L/min |
| Power supply |
AC:220V,50~60HZ |
| Power |
1.5KW |
Application Range:
# Encapsulation protection of PCB board and FPC soft board parts,
# Reinforcement of camera module, fingerprint recognition module
# Dispensing IC chip, component underfill and component
# Encapsulation shell frame dispensing
# Red phosphor, dam, precision coating, etc.
Products characteristics:
1.FPC Dispensing
Introduction: FPC flexible circuit board is a flexible printed circuit board with high reliability and high quality, which is made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability.
Feature:With the development trend of miniaturization, portability and diversification of functions of electronic products, in order to improve the reliability of the tiny flexible substrate (FPC), the entire components (such as 0402, 0201) are encapsulated, or the lead chip is introduced. Foot encapsulation has become an indispensable process, and flexible substrates (FPC) are often used in miniaturized portable electronic products, such as smartphone cameras, microphones, and display screens. The size itself is tiny, the pitch between each device is very small, and the process of each device cannot affect each other. In this way, higher requirements are placed on the equipment of the encapsulation process.
2.Camera Module Dispensing
Introduction:The performance of the digital camera of the mobile phone in the development stage should also be in the preliminary stage, only some mobile phone cameras have the optical zoom function. However, with the development of mobile phone digital camera functions, most of them have digital zoom functions. In addition, the mobile phone's digital camera functions mainly include shooting still images, continuous shooting function, movie shooting, lens rotation, automatic white balance, built-in flash and so on. The shooting function of a mobile phone is directly related to its screen material, screen resolution, camera pixels, and camera material.
Feature:The development of the global smartphone industry has promoted the rapid development of the mobile phone camera module industry. The entire dispensing process of mobile phone camera modules is cumbersome and precise. Using high-speed dispensers to dispense mobile phone modules can effectively solve the above problems. The camera module mainly includes the following parts: FPC, SENSOR, LENS, VCM, etc. Its internal structure is complex and precise, and many components need to be assembled by dispensing.
3. Inkjet process (LED display)
Introduction:
A, Technical barriers for smaller pitch displays: uneven heat dissipation, inconsistent brightness and chromaticity, inconsistent ink color, low contrast, dust, moisture, vibration, hidden quality problems, flatness and bright and dark lines caused by stitching, etc.
B, Factors affecting the consistency of the ink color of the LED display: the influence of the color difference of the PCB substrate, the influence of the consistency of the LED lamp placement (such as height and tilt), the influence of the ink color of the LED lamp housing, the fullness of the solder joint of the LED lamp pin Influence (different refracted light), the influence of fullness of LED lamp epoxy package.
C, Dust, moisture and vibration lead to the problem of hidden quality problems: PCB and LED solder joints are not protected by three protections, LED solder joints are only fixed by solder, solder is a brittle metal material, when the PCB deforms due to excessive force and external force collision It is easy to cause breakage, and the solder joints of the LED display lamp pins are not reinforced (dispensed), and the LED display is not suitable for installation in places with severe vibration (such as cars, ships, etc.)
D, Process methods for improving the consistency of the ink color of the display screen: mask process and spraying ink process, the disadvantages of the mask process are as follows:
•Open mold for production, high cost;
The installation of the mask needs to be fixed with screws, which increases the cost of personnel; the mask with small spacing needs to be fixed with double-sided adhesive (rubber glue), which is difficult for personnel to operate and has low efficiency;
• There are hidden quality risks: face masks fixed with adhesive tape are prone to warp after being heated. This situation usually occurs in about a year, resulting in product maintenance, increasing after-sales costs and affecting the company's product quality;
• Poor display effect: In order to ensure the flatness of the mask, it is necessary to add a hub frame on the mask, which causes the viewing angle of the entire screen to be narrow, which affects the visual effect.
• The operation difficulty of the ultra-small high-spacing display is increased: the ultra-small-spacing display uses a mask to increase the difficulty of operation, and there is basically no way to work below 1.2mm
| Features: |
| The inkjet process produced can make up for the deficiencies of the mask process, solve the problem of warping, and narrow the angle of view; |
•No need to open the mold to produce the mask, no need to manually apply the mask, which reduces the production cost;
• Fully automated production, reduce the labor intensity of operators and increase production efficiency;
• Inkjet operation can be carried out at very small lamp pitch, which improves the display quality;
• Simple programming, automatic calibration mode, as long as the operator can use the computer to operate the machine, no professional knowledge is required, and the practicality is strong |
|
|
4.Mobile Phone Frame Dispensing
Background:
1, As an industry in full swing, smartphones have many applications for dispensing. In addition to traditional UF, camera, mute keys, volume keys, antenna fixing, and soft board reinforcement, screen bonding is also a very conventional application..
2, Nowadays, the screen size of mobile phones is getting larger and larger. Various mobile phone manufacturers also increase the size of the screen as much as possible when the size of the mobile phone is fixed. Then the dispensing position reserved for the bonding of the mobile phone screen and the outer frame is It will become smaller and smaller, and it is also developing in the direction of narrow borders or even no borders.
3, The output of mobile phones is very large, which has high requirements on the utilization rate of equipment and UPH.
Feature:
In the process of mobile phone production and assembly, frame bonding is a very important link. Its traditional production process is mainly quick-drying glue and adhesive tape. Such production processes are prone to problems such as insufficient bonding strength and poor sealing performance . The hot-melt adhesive used in the mobile phone frame has the characteristics of fast curing speed, high bonding strength and good sealing performance, so it quickly replaces the traditional bonding process and is the mainstream production process at this stage.
5.Underfill Dispensing
Introduction:
Underfill technology originated from IBM in the 1970s and has now become an important part of the electronics manufacturing industry. At first, the scope of application of this technology was limited to ceramic substrates. It was known that the industry has transitioned from ceramic substrates to organic (stacked) substrates. Underfill technology was only used on a large scale, and the use of organic underfill materials was determined as an industry standard.
Feature:
With the development trend of miniaturization, portability and diversification of functions of electronic products, underfilling has become a necessary process for improving the reliability of electronic products. For CSP, BGA, POP, underfill improves its impact resistance; for FLIP CHIP, thermal stress due to inconsistent thermal expansion coefficients (CTE) leads to solder ball failure, and underfill improves its ability to resist thermal stress.
6. Automotive Electronics (Dispensing of Central Control Electronic Components)
Introduction:
Electronic components are components of electronic originals and small electric machines and instruments. They are often composed of several parts and can be used in similar products; often refer to certain parts of electrical appliances, instruments and other industries, such as capacitors, transistors, hairsprings , Clockwork and other sub-device general term. Common ones are diodes, etc.
Feature:
Encapsulation protection, fixed, moisture-proof, dust-proof.
Product feature:
# Stable professional control software makes the dispensing process more perfect.
# Servo motor + high-precision grinding silent screw, to ensure high speed, high precision and high consistency of movement.
# Industrial CCD vision positioning system.
# Simple and easy-to-use programming interface supports CAD graphics import and track preview.
# Modular design, daily cleaning and maintenance are simple and convenient.
1, The integrated welding frame has strong rigidity and high stability, reduces the vibration of the machine under high-speed operation, and ensures production stability.
2, Modular structure design, imported parts ensure high-speed, high-precision operation of the machine, helping customers achieve high-efficiency production.
3, Non-contact high-speed injection valve, high precision, high repeatability, up to 200 points per second ultra-high dispensing speed, can handle a variety of commonly used glue.
Non-contact high-speed jet dispensing valve
Non-contact high-speed jet dispensing valve, can spray epoxy, UV, silicone, acrylic, conductive adhesive and other commonly used glue, suitable for applications requiring high-speed non- contact dispensing, such as Flip-chip and BGA underfill,Die Attach Epoxy for chip mounting, Conformal Coating for SMT components,Lens Fixing for camera modules, Encapsulation, and Surface Mounted Package, Fingerprint sensor application(Fingerprint sensor)
Features:
# Non-contact jet dispensing technology
# Super high-speed dispensing, up to 280 points/second
# Minimum glue dot size∶ 200μ m
# Precise and precise dispensing
# Easy to clean and maintain
# Improved design greatly prolongsthe servicelife of valves and consumables
# Utra-low use cost
| Dimensions |
76mmx59mmx130mm(LxDxH) |
| Weight |
0.6Kg |
| Maximum dispensing speed |
280 points per second |
| Minimum point diameter |
200μm |
| Nozzle diameter |
0.05 mm to 0.6 mm |
| SOLENOID INPUT air pressure |
Min.0.6Mpa |
| Maximum heating temperature |
100ºC |
Exterior Dimension:
Company information:
HTGD (GDK) is committed to take the professional line, to enrich the SMT professional and technical service experience, process improvement and effective solutions, rich practical experience to provide customers with appropriate and economical and reliable recommendations to meet the special needs of all types of customers. The company established a head office in Shenzhen and set up branch offices in Dongguan, Suzhou, Tianjin, Chongqing, Xi'an and Xiamen. At the same time, there are many branches and agents overseas, forming a strong distribution and service network in the world.
Major application range is SMT & PCB assembly, consumer electronics products, auto industry, LED assembly, medical electronics industry, etc.
- Shenzhen HTGD Intelligent Equipment Co., Ltd established in 2008.
- 300+ staffs
- 2,000 sets machines production capability per year
- Sales and service covers 35+ countries around the world.
- Focus on design&research based on customer's request
- HTGD & GDK two brands
- 40,000 square meter advanced standard production workshop
- ISO 9001 approval and CE certificate
- More than 80 utility model patents and 5 invention patents
- 30000+ big customers in China, who are specialized in cell phone, home appliance spare parts, medical electrical parts, etc.
HTGD&GDK is focus on solder paste( screen printer), AOI, SPI, dispenser, loader, unloader, conveyor, reflow oven, design and produce, and provide SMT whole line service for customers around the world. Meanwhile provide THT whole line service too.
Production line:
10000 square meters standard modern standard precision equipment production work
After-Sales service:
Technical support
# From the purchase date, one year free warranty, lifelong maintenance
# Provide technical update and technical service at any time
# Software system life - long free upgrade, to ensure the latest version of the software and perfect functions
# Provide technical training according to customer needs
Service support
# Since the date of purchase, the customer has become a lifetime member of our company and enjoys the all-day waiting service
# Make phone calls and on-site visits to customers from time to time, communicate with customers and improve related problems in a timely manner
# Provide door-to-door service, one - on - one designated service policy
Advantage, Why choose us:
1. GDK,HTGD Self-branded famous manufacture around the world
2. Self developed and owned software, Company industry experience
3. 2000 sets production capability per year
4. CE,ISO,TUV certified company
5. We have many years of SMT sales, installation and after-sales service experience.
6. We have exported the whole line of SMT equipment in North America,South America, Europe, Southeast Asia, Middle East and other countries. Many of them are new customers starting from scratch.
7. We assist customers to train professional technicians and provide technical support at any time.
8. We solve all SMT problems for our customers.
Customer Visiting:
Other Products support:
We are specilize in automatic solder paste printer, inline AOI , inline SPI, High speed glue dispenser. And we support complete SMT whole Line machine, such as pick and place machine(chip mounter),used chip mounter, reflow oven, wave soldering machine, PCB magazine /Loader/Unloader,conveyor,laser marker and etc.
Exhibition show:
Packing: VACUMME +WOODEN BOX.
------------FAQ----------------------------------------------------
Q: What we can do for you?
A: Total SMT Machines and Solution, professional Technical Support and Service.
Q:Are you a trade company or a manufacturer?
A: OEM & ODM service are available.
Q: What is your delivery date?
A: The delivery date is about 35 days after receipt of payment.
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